product series
Wire Enamel
Self-Bonding
| SELF-BONDING – POLYAMIDE |
|---|
| Type | Sold Content（2g1h180°C） | Viscosity （mPa.s,23°C） | Wire Size（mm） | Thinner | Application Method |
| YD618/15 | 15±1% | 1900-3000 mPa.s | 0.04-1.00 | YD300 | Dies or felts |
| YD618/17 | 17±1% | 2500-3700 mPa.s | 0.04-1.00 | YD300 | Dies or felts |
| YD618/19 | 19±1% | 3100-4100 mPa.s | 0.04-1.00 | YD300 | Dies or felts |
| YD628/15 | 15±1% | 700-1300 mPa.s | 0.06-1.00 | YD300 | Dies or felts |
| YD628/19 | 19±1% | 1700-2700 mPa.s | 0.06-1.60 | YD300 | Dies or felts |
| SELF-BONDING – EPOXY CLASS C (200°C) |
|---|
| Type | Sold Content（2g1h180°C） | Viscosity （mPa.s,23°C） | Wire Size（mm） | Thinner | Application Method |
| YD638/17 | 17±1% | 800-1100 mPa.s | 0.04-2.00 | YD300 | Dies or felts |
| YD638/19 | 19±1% | 1000-1500 mPa.s | 0.04-2.00 | YD300 | Dies or felts |
